Sheila G. Bailey - Lakewood OH David M. Wilt - Bay Village OH Frank L. DeAngelo - Parma OH
Assignee:
The United States of America as represented by the Administrator of the National Aeronautics and Space Administration - Washington DC
International Classification:
B44C 122 H01L 21306
US Classification:
438455
Abstract:
The present invention is directed toward a method of removing epitaxial substrates from host substrates. A sacrificial release layer of ternary material is placed on the substrate. A layer of InP is then placed on the ternary material. Afterward a layer of wax is applied to the InP layer to apply compressive force and an etchant material is used to remove the sacrificial release layer.