A heat energy powered earphone is provided, which utilizes a thermoelectric (TE) module that is connected to an external heat exchanger clip. The clip can be affixed to a cool location such as the top of an ear, a hat, or other piece of clothing. The clip may connect to the TE module via a simple heat pipe. By using the clip, the earphone housing may be manufactured with a compact form factor that enables close insertion to the inner ear. Additionally, by providing an open hole in the TE module, audio waves can pass through unobstructed. Power management, wireless transmission, and audio playback circuitry may be provided via a tethered wire to an external electronics module. Interfacing methods are also provided, including a method for automatic pairing with an audio source upon insertion of the earphone, and a method for adjusting a fit of the earphone using audio feedback.