A grayscale reference generator provides correction voltages to respective connection points on a source driver which drives an array of LCD pixels, to compensate for pixel non-linearity. The generator includes a number of DACs equal to the number of correction voltages. In a preferred embodiment, an analog multiplexer connected between the DACs and the source drivers connection points selectively connects the DAC outputs to the connection points so that the source driver produces the necessary pixel drive voltages as the voltage polarity across the pixels is periodically reversed.
Rail-To-Rail Amplifier For Use In Line-Inversion Lcd Grayscale Reference Generator
A rail-to-rail amplifier suitable for use in a line-inversion LCD grayscale reference generator comprises a p-type differential pair and a first switchable current source which supplies tail current to the p-type pair in response to a first control signal, and an n-type pair and a second switchable current source which supplies tail current to the n-type pair in response to a second control signal; when its tail current is present, each pair provides a differential output current which varies with a differential input signal. A control circuit provides the control signals such that the first switchable current source is enabled when a voltage applied to the amplifier's input is closer to the amplifier's negative supply rail, and the second switchable current source is enabled when the applied voltage is closer to the amplifier's positive supply rail, such that only one input pair is active at any given time.
Semiconductor Device Having Mode Of Operation Defined By Inner Bump Assembly Connection
Semiconductor devices are described that are configured to have a state of operation defined by a connection between at least one inner bump assembly and a selected outer bump assembly. In an implementation, the semiconductor device, which may be a wafer-level (chip-scale) package semiconductor device, includes an integrated circuit chip, a plurality of outer bump assemblies disposed on the chip, and one or more inner bump assemblies disposed on the chip so that the inner bump assemblies are at least partially surrounded by the outer bump assemblies. At least one of the inner bump assemblies is configured to be connected to a selected outer bump assembly to cause the integrated circuit chip to have a desired state of operation.
An earthquake safety system employing a shock triggered electrical switch for opening electrical contacts in the cables between the power utility input to a building and the distribution circuit breaker box. The switch is adjustable to be closed by earthquakes of predetermined magnitudes. Normally-closed solenoid gas and water valves coupled to breakers in the circuit breaker box will close upon the opening of the contacts to prevent gas fire and water damage and loss of water main pressure.
High Output Impedance Audio Amplifier For Noise Rejection
A hearable has an audio amplifier circuit coupled to a speaker as a load. The amplifier circuit has current source drive, which attenuates electromagnetically coupled noise of the speaker. In other instances, the amplifier circuit has a first amplifier mode and a second amplifier mode, wherein in the first amplifier mode the amplifier circuit becomes configured to drive the speaker as a voltage source, and in the second amplifier mode the amplifier circuit becomes configured to drive the speaker as a current source. Control logic varies the amplifier circuit between i) the first amplifier mode for larger amplitudes of the audio signal, and ii) the second amplifier mode for smaller amplitudes of the audio signal. Other aspects are also described and claimed.
High Output Impedance Audio Amplifier For Noise Rejection
A hearable has an audio amplifier circuit coupled to a speaker as a load. The amplifier circuit has current source drive, which attenuates electromagnetically coupled noise of the speaker. In other instances, the amplifier circuit has a first amplifier mode and a second amplifier mode, wherein in the first amplifier mode the amplifier circuit becomes configured to drive the speaker as a voltage source, and in the second amplifier mode the amplifier circuit becomes configured to drive the speaker as a current source. Control logic varies the amplifier circuit between i) the first amplifier mode for larger amplitudes of the audio signal, and ii) the second amplifier mode for smaller amplitudes of the audio signal. Other aspects are also described and claimed.
- Cupertino CA, US Roderick B. Hogan - San Francisco CA, US Nathan A. Johanningsmeier - San Jose CA, US
International Classification:
H02M 3/07 H03F 3/19 H03F 3/183
Abstract:
A charge pump circuit having first and second input nodes to be coupled to a first power source, and top and bottom output nodes and an intermediate node. The charge pump circuit produces i) a voltage at the top output node that is higher than a voltage of the intermediate node, and ii) a voltage at the bottom output node that is lower than the voltage of the intermediate node. A bias voltage source has i) an input that is to be coupled to a second power source and ii) an output that produces an output voltage, which is a predetermined proportion of an input voltage at the input and that follows the input voltage downward and upward as the input voltage sags and recovers, respectively. The output of the bias voltage source is directly connected to the intermediate node of the output stage. Other embodiments are also described.
- Cupertino CA, US Alexander V. Salvatti - Morgan Hill CA, US Thomas M. Jensen - San Francisco CA, US Scott P. Porter - San Jose CA, US Ruchir M. Dave - San Jose CA, US Andrew P. Bright - San Francisco CA, US Roderick B. Hogan - San Francisco CA, US
International Classification:
H04R 9/02 H04R 7/16
Abstract:
A micro speaker having a capacitive sensor to sense a motion of a speaker diaphragm, is disclosed. More particularly, embodiments of the micro speaker include a conductive surface of a diaphragm facing conductive surfaces of several capacitive plate sections across a gap. The diaphragm may be configured to emit sound forward away from a magnet of the micro speaker, and the capacitive plate sections may be supported on the magnet behind the diaphragm. In an embodiment, the gap provides an available travel for the diaphragm, which may be only a few millimeters. A sensing circuit may sense capacitances of the conductive surfaces to limit displacement of the diaphragm to within the available travel.
Apple - Cupertino, CA since Jan 2013
Mixed-Signal Audio Architect
Texas Instruments - Santa Clara, CA Feb 2011 - Jan 2013
Director, Audio Applications
Maxim Integrated Products Jan 2006 - Mar 2011
Senior Audio Business Manager
Analog Devices Aug 2004 - Jan 2006
Test Development & Product Engineering Manager - Displays Technology Products Group
Analog Devices Apr 2002 - Aug 2004
Senior Design Engineer - Precision Amplifier & Displays Technology Group
Education:
Cork Institute of Technology 1989 - 1996
BSEE, Electronic Engineering
Skills:
Analog Semiconductors Mixed Signal Ic Consumer Electronics Semiconductor Industry Electronics Hardware Architecture Silicon Analog Circuit Design Engineering Management Soc Integrated Circuit Design Sound Circuit Design Cmos Asic Power Management Audio Technical Leadership Integrated Circuits
Roderick Hogan 1982 graduate of Penfield High School in Penfield, NY is on Classmates.com. See pictures, plan your class reunion and get caught up with Roderick and other high ...