Raymond E Thompson

US Patent:

6868953, Mar 22, 2005

Filed:

Apr 22, 2002

Appl. No.:

10/127270

Inventors:

Raymond F. Thompson - Conroe TX, US

International Classification:

B65G011/00

US Classification:

193 10, 193 5, 193 6, 193 2 R

Abstract:

A concrete chute apparatus for preventing the accidental discharge of cement residue from the chute of a cement truck while the truck is moving is disclosed. To attain this, an abutment plate obstructs the opening of a cement truck caused by the folding of an articulated chute. In an embodiment, an abutment plate is rigidly affixed to an over-chute section of the articulated chute such that the plate obscures the concrete path when the over-chute section is rotated to the up position.

US Patent:

59769149, Nov 2, 1999

Filed:

Aug 26, 1997

Appl. No.:

8/918404

Inventors:

John H. Abbott - Missouri City TX
Navinchandra Kalidas - Houston TX
Raymond W. Thompson - Sugar Land TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438123

Abstract:

In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package (10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).

US Patent:

57773823, Jul 7, 1998

Filed:

Dec 19, 1996

Appl. No.:

8/769917

Inventors:

John H. Abbott - Missouri City TX
Navinchandra Kalidas - Houston TX
Raymond W. Thompson - Sugar Land TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2348
H01L 23495
H01L 2328

US Classification:

257695

Abstract:

In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package(10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).

Address:

28714 Holly Hl Ct, Shenandoah, TX 77381

VIN:

3GNFC16J17G120670

Make:

CHEVROLET

Model:

SUBURBAN

Year:

2007