Matthew W Shannon

US Patent:

20210076504, Mar 11, 2021

Filed:

Dec 20, 2018

Appl. No.:

16/955771

Inventors:

- Lisle IL, US
Matthew SHANNON - Lisle IL, US
Steve R. MOSER - Lisle IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H05K 3/32
H05K 3/12
H05K 1/18
H05K 1/11

Abstract:

A method for creating a circuit assembly includes printing first conductive traces on a first side of a flexible substrate, printing second conductive traces on a second side of the flexible substrate opposite to the first side, and placing the flexible substrate on a first pallet with the first side facing up. The method includes printing conductive adhesive to form first contact pads on the first side, placing at least one first component onto the first contact pads, and removing the flexible substrate from the first pallet. The method includes placing the flexible substrate on a second pallet with the second side facing up, where the second pallet includes recessed areas or cut outs that align with the at least one first component, printing conductive adhesive to form second contact pads on the second side, and placing at least one second component onto the second contact pads.