Martin B Rodriguez

US Patent:

20200066659, Feb 27, 2020

Filed:

Aug 21, 2018

Appl. No.:

16/107791

Inventors:

- Santa Clara CA, US
Omkar Karhade - Chandler AZ, US
Martin Rodriguez - Phoenix AZ, US
Gregorio R. Murtagian - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/64
H01L 23/522
H01L 23/495
H01F 27/24
H01L 49/02

Abstract:

A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.