Kurt E Schultz

US Patent:

7585615, Sep 8, 2009

Filed:

Jul 27, 2006

Appl. No.:

11/495368

Inventors:

Kurt Schultz - Banks OR, US
Kevin J. Lee - Beaverton OR, US
Michael D. Goodner - Hillsboro OR, US
Shane Nolen - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G03F 7/00
G03F 7/004

US Classification:

430311, 4302701, 430138, 430322, 430325, 430330

Abstract:

A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.

US Patent:

20080003715, Jan 3, 2008

Filed:

Jun 30, 2006

Appl. No.:

11/479091

Inventors:

Kevin J. Lee - Beaverton OR, US
Figen T. Akin - Portland OR, US
Kurt Schultz - Banks OR, US
Raman Vaidyanathan - Hillsboro OR, US
Shane A. Nolen - Portland OR, US
Adwait Telang - Hillsboro OR, US

International Classification:

H01L 21/00

US Classification:

438108

Abstract:

Embodiments of the invention include apparatuses and methods relating to die-side bumps having a tapered cross-section. In one embodiment, the tapered die-side bump is electrically coupled to a solder bump on a package substrate.

US Patent:

20130069680, Mar 21, 2013

Filed:

Sep 11, 2012

Appl. No.:

13/610076

Inventors:

Koby L. Duckworth - Newberg OR, US
Eric Hill - Portland OR, US
Mike Jolley - Beaverton OR, US
Kurt Schultz - Banks OR, US
Jody Curtis - Portland OR, US

Assignee:

Cascade Microtech, Inc. - Beaverton OR

International Classification:

G01R 1/073
H05K 3/10
H05K 1/11

US Classification:

32475403, 32475501, 174261, 427 58

Abstract:

Risers including a plurality of high aspect ratio electrical conduits, as well as systems and methods of manufacture and/or use of the risers and/or the high aspect ratio electrical conduits. The systems and methods may include incorporation of the plurality of high aspect ratio electrical conduits within a substantially planar body that may include and/or be formed from a solid dielectric material. The plurality of electrical conduits may be configured to conduct a plurality of electric currents between a first surface of the body and a second, substantially opposed, surface of the body. The surfaces may include a plurality of contact pads configured to provide a robust and/or corrosion-resistant surface and/or to improve electrical contact between the riser and another device. The risers also may include a layered structure, wherein the layers are sequentially formed to increase a thickness of the riser and/or the aspect ratio of the electrical conduits.