Juan Carlos Alfonso

US Patent:

52204898, Jun 15, 1993

Filed:

Oct 11, 1991

Appl. No.:

7/774921

Inventors:

Joaquin Barreto - Sunrise FL
Juan O. Alfonso - Fort Lauderdale FL
Frank J. Juskey - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 702

US Classification:

361400

Abstract:

An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).

Address:

11005 SW 1 St APT 108, Miami, FL 33174

VIN:

JHMCM56167C004981

Make:

HONDA

Model:

ACCORD

Year:

2007