Jason Drury Munn

US Patent:

7120987, Oct 17, 2006

Filed:

Aug 5, 2003

Appl. No.:

10/634243

Inventors:

Peikang Liu - Claremont CA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Garden Grove CA, US
Scott Wayne Ferguson - Arcadia CA, US
Jason D. Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 13/00
H01Q 1/38

US Classification:

29600, 29825, 29832, 29601, 295921, 343867, 343700 MS, 3405727

Abstract:

A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

US Patent:

7224280, May 29, 2007

Filed:

Jun 18, 2004

Appl. No.:

10/871169

Inventors:

Scott Wayne Ferguson - Pasadena CA, US
David N. Edwards - La Canada CA, US
Peikang Liu - Claremont CA, US
Jason Munn - West Covina CA, US
Ian J. Forster - Chelmsford, GB
Samuel A. Linder - Moore SC, US
Thomas Craig Weakley - Simpsonville SC, US
David Puleston - Duluth GA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Grove CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 13/14

US Classification:

3405727, 343873, 343895

Abstract:

A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.

US Patent:

7333061, Feb 19, 2008

Filed:

Sep 13, 2006

Appl. No.:

11/520077

Inventors:

Peikang Liu - Claremont CA, US
Steven C. Kennedy - Fontana CA, US
Christine U. Dang - Garden Grove CA, US
Scott Wayne Ferguson - Arcadia CA, US
Jason D. Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 1/38

US Classification:

343700MS, 343767

Abstract:

A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

US Patent:

7500307, Mar 10, 2009

Filed:

Sep 22, 2004

Appl. No.:

10/947010

Inventors:

Jason Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H05K 3/30

US Classification:

29832, 29834, 29836, 296021, 29601, 295921, 3405721

Abstract:

A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

US Patent:

7555826, Jul 7, 2009

Filed:

Dec 22, 2005

Appl. No.:

11/315504

Inventors:

Edward A. Armijo - Fountain Inn SC, US
John F. Hughen - Lake Havasu City AZ, US
Steven C. Kennedy - Simpsonville SC, US
Samuel A. Linder - Moore SC, US
Jason D. Munn - Clinton SC, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01P 11/00

US Classification:

29600, 29601, 29832, 3405721, 3405727, 156256

Abstract:

A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

US Patent:

7669318, Mar 2, 2010

Filed:

Oct 31, 2007

Appl. No.:

11/931478

Inventors:

Jason Munn - West Covina CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H05K 3/30

US Classification:

29832, 29834, 29836, 296021, 29601, 295921, 3405721

Abstract:

A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

US Patent:

7874493, Jan 25, 2011

Filed:

May 29, 2009

Appl. No.:

12/474300

Inventors:

Edward A. Armijo - Fountain Inn SC, US
John F. Hughen - Lake Havasu City AZ, US
Steven C. Kennedy - Simpsonville SC, US
Samuel A. Linder - Moore SC, US
Jason D. Munn - Clinton SC, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G06K 19/00

US Classification:

235492, 3405721, 3405727

Abstract:

A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

US Patent:

8020283, Sep 20, 2011

Filed:

Jan 11, 2010

Appl. No.:

12/685191

Inventors:

Jason D. Munn - Clinton SC, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B23P 19/00

US Classification:

29743, 29739, 29740, 29729, 295921, 4147521

Abstract:

A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.