Howard Hong Chen

US Patent:

20040040980, Mar 4, 2004

Filed:

Aug 29, 2002

Appl. No.:

10/229873

Inventors:

Howard Chen - Temple City CA, US

International Classification:

B65D035/28

US Classification:

222/101000, 222/103000

Abstract:

Toothpaste dispenser will eliminate messy sink counter top. By placing the unit on the mirror or on the wall, with one push of the button, toothpaste will come out and convenient hook for placing the toothbrush and open area for dental floss placement.

US Patent:

20100090866, Apr 15, 2010

Filed:

Oct 13, 2008

Appl. No.:

12/250294

Inventors:

Howard Chen - San Gabriel CA, US
Andrew Joseph Giles - Newport OR, US
Nathaniel Pinckney - Lake Forest CA, US
Sarah Harris - San Diego CA, US
Andrew Danowitz - Saugus CA, US
Samuel Seth Osofsky - Rancho Palos Verdes CA, US

International Classification:

B64F 1/18

US Classification:

340953

Abstract:

A beacon system includes emitter devices, driver circuitry configured for controlling the emitter devices, and at least one processor programmed to receive and process one or more inputs and control the driver circuitry to actuate the emitter devices. In an example embodiment, the emitter devices include visible light sources that are oriented to provide omni-directional visibility for the beacon system. In an example embodiment, components of the beacon system including the emitter devices, driver circuitry and at least one processor are configured such that in a space environment heat generated by the beacon system is dissipated sufficiently well to prevent the beacon system from overheating.

US Patent:

20130324069, Dec 5, 2013

Filed:

May 31, 2012

Appl. No.:

13/485572

Inventors:

Howard E. Chen - Anaheim CA, US
Matthew Sean Read - Rancho Santa Margarita CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Anthony James LoBianco - Irvine CA, US
Guohao Zhang - Irvine CA, US

Assignee:

Skyworks Solutions, Inc. - Woburn MA

International Classification:

H01L 23/552
H04B 1/16
G06F 17/50

US Classification:

455334, 716119, 257659, 257E23114

Abstract:

Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.

US Patent:

20130335288, Dec 19, 2013

Filed:

May 29, 2013

Appl. No.:

13/904566

Inventors:

Hoang Mong Nguyen - Fountain Valley CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US

International Classification:

H01L 23/552
H01Q 1/52
H01L 21/56

US Classification:

343841, 257659, 438127

Abstract:

Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).

US Patent:

20220338342, Oct 20, 2022

Filed:

Mar 11, 2022

Appl. No.:

17/692486

Inventors:

- Irvine CA, US
Howard E. CHEN - Anaheim CA, US
Anthony James LOBIANCO - Irvine CA, US

International Classification:

H05K 1/02
H01L 23/552
H05K 3/40
H01L 23/06
H01L 23/00
H05K 1/03
H05K 1/11
H05K 1/18
H05K 3/00
H05K 3/12
H05K 3/22
H05K 3/42
H05K 3/46

Abstract:

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

US Patent:

20220319968, Oct 6, 2022

Filed:

Mar 29, 2022

Appl. No.:

17/706883

Inventors:

- Irvine CA, US
Howard E. CHEN - Anaheim CA, US

International Classification:

H01L 23/498
H01L 25/10
H01L 23/552
H01L 21/48
H01L 21/56
H01L 23/66

Abstract:

A packaged module can include a packaging substrate with first and sides, first and second components mounted on the first and second sides, respectively, and first and second overmolds implemented on the first and second sides, respectively, with the second overmold defining a mounting surface. The packaged module can further include a plurality of conductive features implemented on the second side of the packaging substrate to provide electrical connections for the packaged module, with the conductive features being formed from conductive material having a sufficiently high melting temperature so that the conductive features do not melt during a mounting operation. Each conductive feature can have a surface that is substantially coplanar with or recessed with respect to the mounting surface, and a solderable material layer can be dimensioned to cover the surface of each conductive feature.

US Patent:

20220310530, Sep 29, 2022

Filed:

Mar 22, 2022

Appl. No.:

17/655801

Inventors:

- Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Sean Read - Foothill Ranch CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US

International Classification:

H01L 23/552
H01L 23/31
H01L 25/065
H01L 23/498
H01L 21/56
H01L 21/48
H01L 25/00

Abstract:

A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

US Patent:

20210045231, Feb 11, 2021

Filed:

Jul 27, 2020

Appl. No.:

16/940075

Inventors:

- Irvine CA, US
Howard E. CHEN - Anaheim CA, US
Anthony James LOBIANCO - Irvine CA, US

International Classification:

H05K 1/02
H01L 23/552
H05K 3/40
H01L 23/06
H01L 23/00
H05K 1/03
H05K 1/11
H05K 1/18
H05K 3/00
H05K 3/12
H05K 3/22
H05K 3/42
H05K 3/46

Abstract:

Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a method for fabricating a ceramic device can include forming a plurality of conductive features on or through a selected layer along a boundary between a first region and a second region, each conductive feature extending into the first region and the second region. The method can also include forming an assembly that includes the selected layer and one or more other layers. The method can further include separating the first region and the second region along the boundary such that each of the first region and the second region forms a side wall, the side wall including exposed portions of the conductive features, the exposed portions capable of forming electrical connection with a conductive shielding layer.