Chung-Ping Chien

US Patent:

51242389, Jun 23, 1992

Filed:

Dec 20, 1990

Appl. No.:

7/631194

Inventors:

Kishore K. Chakravorty - Mercer Island WA
Chung-Ping Chien - Redmond WA

Assignee:

The Boeing Company - Seattle WA

International Classification:

G03C 500

US Classification:

430330

Abstract:

A method of photolithographically patterning a layer of a dielectric composition including a photosensitive polyimide provides patterned dielectric features that have vertical wall profiles that are free of distortions normally associated with high temperature production conditions and shrinkage of the dielectric composition. The method is useful in the production of integrated circuits and high density multiconnect structures.

US Patent:

51224402, Jun 16, 1992

Filed:

May 7, 1990

Appl. No.:

7/519321

Inventors:

Chung-Ping Chien - Redmond WA

International Classification:

G03F 740
G03F 730

US Classification:

430315

Abstract:

Photosensitive polyimides used in microelectronic structures are cross-linked without exposing the associated microelectronic structures to elevated temperatures that can lower the process yield and reduce the reliability of the microelectronic structures. The photosensitive polyimides are cured by exposing them to deep ultraviolet radiation that has a spectral output effective to crosslink the polyimide. The cross-linking hardens the polyimide and renders it insoluble in solvents such as photoresist strippers.

US Patent:

51025060, Apr 7, 1992

Filed:

Apr 10, 1991

Appl. No.:

7/683349

Inventors:

Minas H. Tanielian - Bellevue WA
Chung-Ping Chien - Redmond WA

Assignee:

The Boeing Company - Seattle WA

International Classification:

C25D 502

US Classification:

205118

Abstract:

A zinc-based temporary electrical connection (e. g. , a microfuse) useful in electroplating isolated conductor (i. e. , copper) structures and copper/polyimide high-density interconnect structures are disclosed. The microfuse includes a zinc conductor layer, and in some embodiments, additional silicon adhesion and silicon protection layers. The microfuse is conductive, and therefore useful in an electroplating process, until it is treated (e. g. , heated to about 400. degree. C. for one hour), to convert it into an insulator due to zinc oxidation, and remains in this state.

US Patent:

51685426, Dec 1, 1992

Filed:

Oct 9, 1991

Appl. No.:

7/773158

Inventors:

Kishore K. Chakravorty - Issaquah WA
Chung-Ping Chien - Redmond WA

Assignee:

The Boeing Company - Seattle WA

International Classification:

G02B 610
G03G 1500

US Classification:

385132

Abstract:

Optical waveguides for use in planar structures, such as dielectric layers in multichip modules exhibit low optical loss. The optical waveguides are provided by methods that involve doping of the dielectric layers. The waveguides can be used to interconnect electronic elements and transmit signals at speeds that are compatible with high speed electronic elements.

US Patent:

59452544, Aug 31, 1999

Filed:

Dec 18, 1996

Appl. No.:

8/768599

Inventors:

Chung-Ping Chien - Redmond WA
Jean A. Nielsen - Kent WA
Peter L. Young - Mercer Island WA

Assignee:

The Boeing Company

International Classification:

G03C 558
G03F 740

US Classification:

430296

Abstract:

A method for manufacturing a multichip module deposited substrate board utilizing alternating layers of high density thin-film metal and either preimidized or non-preimidized organic polymer insulating material wherein the insulating material is cured during manufacture using either ultraviolet radiation, ion beam radiation or electron beam radiation. This method eliminates subjecting the in-process substrate board to temperatures in excess of the recrystalization temperature of the thin-film metal, thereby eliminating the source of warpage and metal interdiffusion and corrosion at the metal to insulating material interface. This process enables successful manufacture of large format multichip module deposited substrate boards in sizes up to approximately 24 inches square.