Christopher C Schaffer

US Patent:

6489634, Dec 3, 2002

Filed:

Aug 22, 2001

Appl. No.:

09/938073

Inventors:

Christopher Schaffer - Long Beach CA
Steven R. Burkhart - Hermosa Beach CA
Bartley J. Price - El Segundo CA

Assignee:

The Boeing Company - Seattle WA

International Classification:

H01L 310312

US Classification:

257 77, 257706, 257707, 257708, 257712, 257713, 257732

Abstract:

A microelectronic device structure includes a package flange with a body having a body upper surface, a substantially circular body interior sidewall defining an opening in the body upper surface, and a substantially circular inlay made of CVD diamond. The inlay is received into the substantially circular opening and has an inlay exterior sidewall which is adjacent to the body interior sidewall and is brazed thereto. The inlay has an inlay upper surface that is substantially coplanar with the body upper surface. A microelectronic device is affixed to the inlay upper surface.

US Patent:

6534792, Mar 18, 2003

Filed:

May 18, 2000

Appl. No.:

09/573249

Inventors:

Christopher P. Schaffer - Long Beach CA

Assignee:

The Boeing Company - Seattle WA

International Classification:

H01L 23373

US Classification:

257 77, 257712, 257720

Abstract:

A microelectronic device structure includes a diamond-containing substrate, and a metallic interlayer affixed to the diamond. The interlayer is made of a metal such as copper, silver, or gold, has a thickness of from about 0. 003 inch to about 0. 009 inch, and has an upper surface. A microelectronic device die is affixed to the upper surface of the metallic interlayer. The material of construction and thickness of the metallic interlayer are selected such that a coefficient of thermal expansion at the upper surface of the metallic interlayer is greater than a coefficient of thermal expansion of the die of the microelectronic device by up to about 3 parts per million per degree Centigrade.

US Patent:

6946740, Sep 20, 2005

Filed:

Jul 14, 2003

Appl. No.:

10/620029

Inventors:

Christopher P. Schaffer - Long Beach CA, US

Assignee:

International Rectifier Corporation - El Segundo CA

International Classification:

H01L023/48

US Classification:

257777, 257778, 257779, 257780

Abstract:

A multi-chip module that includes a conductive element to serve as an electrical connector for electrically connecting respective electrical contacts of at least two power semiconductor devices and serving as an output connector. The conductive element improving heat transfer from the power semiconductor devices through the top of the module.

US Patent:

7355431, Apr 8, 2008

Filed:

Jun 1, 2005

Appl. No.:

11/141860

Inventors:

Christopher P Schaffer - Long Beach CA, US
Johan Strydom - El Segundo CA, US
Andrea Ciuffoli - Redondo Beach CA, US

Assignee:

International Rectifier Corporation - El Segundo CA

International Classification:

G01R 31/26

US Classification:

324765, 324755

Abstract:

A testing apparatus and method for testing a semiconductor device, and more particularly a test arrangement for measuring a guaranteed power loss of a semiconductor module, not requiring the module to have on-board decoupling capacitors for the power loss test. The conventional pogo-pin array and test socket are replaced by a novel low cost anisotropic conductive elastomer and a low cost socket, the conductive polymer providing electrical communication between the socket and the module under test.

US Patent:

7453146, Nov 18, 2008

Filed:

Jun 1, 2005

Appl. No.:

11/141861

Inventors:

Christopher P. Schaffer - Long Beach CA, US

Assignee:

International Rectifier Corporation - El Segundo CA

International Classification:

H01L 23/34

US Classification:

257723, 257724, 257E25011

Abstract:

A structure and a manufacturing method providing improved coplanarity accommodation and heat dissipation in a multi-chip module. One of the components in a multi-chip module (MCM) is provided with a recess formed in its respective top surface; and a film is applied so as to cover the top surfaces of the components and so that any excess film can enter into the recess. The recess is preferably a peripheral groove. Then when molding material is injected, it may surround and seal the side surfaces of the components, while not substantially covering the top surfaces that are covered by the film. Since the recess receives any excess film material that may be present, it may prevent such excess film material from covering the respective side surfaces of the corresponding component and creating a void between the component and the molding material. This advantageous effect of the invention is particularly useful when the top component surface in which the recess is formed is higher above the circuit substrate than the respective top surface of another one of the components.

US Patent:

20020182975, Dec 5, 2002

Filed:

May 29, 2001

Appl. No.:

09/866945

Inventors:

Christopher Schaffer - Los Angeles CA, US

International Classification:

A63H003/14
A63H017/00
G09B019/00

US Classification:

446/327000, 446/330000, 446/376000, 446/279000, 434/256000

Abstract:

A sports demonstration figure including a body portion comprised of a leg portion, a torso portion, a pair of arm portions, and a head portion. The leg portion has a pair of apertures therein dimensioned for receiving two fingers therein. The leg portion has a pair of openings disposed on lower ends thereof.